Is low melt(138°C) solderpaste ok to use for assembly?

I have only used normal leadfree Solderpaste in the past(mostly from AIM, but also some other brands). In my new job, the Equipment is quite different and the solderpaste is chipquick thermally stable low melt. So far i have some dewetting and bridging problems. Previous person left before i joined, so no idea if it's normal with the paste or there are problems with other Equipment (printer or oven). So is the low melt stuff as good as the normal leadfree paste?